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產(chǎn)品系列

羅斌森

  • FES6G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

極速報價

型號
 品牌 封裝 批號 查看
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DM74S258N ON 16-PDIP New 詳細(xì)
AMIS30532C5321G ON 32-NQFP (7x7) New 詳細(xì)
BCP56-10T3G ON SOT-223 (TO-261) New 詳細(xì)
MMBZ27VAWT1G ON SC-70-3 (SOT323) New 詳細(xì)
74F646MSA ON 24-SSOP New 詳細(xì)
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FSA3230UMX ON 16-UMLP (1.8x2.6) New 詳細(xì)
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STK672-440A-E ON New 詳細(xì)
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MMBT3904WT1G ON SC-70-3 (SOT323) New 詳細(xì)
LY85_BZ84C8V2 ON Die New 詳細(xì)
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FGA180N33ATTU ON TO-3P New 詳細(xì)