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羅斌森

  • MAX20323FENC+

  • Manufacturer : Maxim Integrated
    Packaging : Tube
    Alternate Packaging
    Part Status : Active
    Applications : Mobile Communications
    Current - Supply : 35μA ~ 170μA
    Voltage - Supply : 2.5V ~ 5.5V
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 12-XFBGA, WLPBGA
    Supplier Device Package : 12-WLP (1.70x1.32)

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