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產(chǎn)品系列

羅斌森

  • NVMYS1D3N04CTWG

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Supplier Device Package : LFPAK4 (5x6)
    Package / Case : SC-100, SOT-669

極速報(bào)價

型號
 品牌 封裝 批號 查看
NLU2G07AMX1TCG ON 6-ULLGA (1.45x1) New 詳細(xì)
2N3906RLRAG ON TO-92-3 New 詳細(xì)
NTD3055-094T4G ON DPAK New 詳細(xì)
MMQA15VT1G ON SC-74 New 詳細(xì)
FQI3N90TU ON I2PAK (TO-262) New 詳細(xì)
FFP20U60DNTU ON TO-220-3 New 詳細(xì)
H11AA43S ON 6-SMD New 詳細(xì)
MC74ACT640MELG ON SOEIAJ-20 New 詳細(xì)
J110 ON TO-92-3 New 詳細(xì)
NCP1090DG ON 8-SOIC New 詳細(xì)
MC74HC1G00DTT1 ON 5-TSOP New 詳細(xì)
FODM3010R3V ON 4-SMD New 詳細(xì)
FAN5067MX ON 16-SOIC New 詳細(xì)
NCP551SN28T1 ON 5-TSOP New 詳細(xì)
MC10EP35DTR2G ON New 詳細(xì)
74AC153SJX ON 16-SOP New 詳細(xì)
NCP4306AAHZZZADR2G ON New 詳細(xì)
MC74VHC1G86DFT2 ON SC-88A (SC-70-5/SOT-353) New 詳細(xì)
SZMMBZ5230BLT1G ON SOT-23-3 (TO-236) New 詳細(xì)
SCAN18374TSSCX ON New 詳細(xì)