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羅斌森

  • NCP6336BFCCT1G

  • Manufacturer : ON Semiconductor
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Part Status : Not For New Designs
    Mounting Type : Surface Mount
    Package / Case : 20-UFBGA, WLCSP
    Supplier Device Package : 20-WLCSP (1.62x2.02)

極速報(bào)價(jià)

型號
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